SEAMP-20-02.0-S-04

制造商 :

Samtec, Inc.

产品分类 :

阵列，边缘类型，夹层（板对板）

Connector Type :

High Density Array, Male

Contact Finish :

Gold

Contact Finish Thickness :

30.0µin (0.76µm)

Features :

-

Mated Stacking Heights :

7mm

Mounting Type :

Through Hole

Number of Positions :

80

Number of Rows :

4

Product Status :

Active