XC3S2000-4FG676I

制造商 :

AMD Xilinx

产品分类 :

FPGA（现场可编程门阵列）

Mounting Type :

Surface Mount

Number of Gates :

2000000

Number of I/O :

489

Number of LABs/CLBs :

5120

Number of Logic Elements/Cells :

46080

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

676-BGA

Product Status :

Active

Supplier Device Package :

676-FBGA (27x27)

Total RAM Bits :

737280

Voltage - Supply :

1.14V ~ 1.26V