XCV1600E-6FG860C

制造商 :

AMD Xilinx

产品分类 :

FPGA（现场可编程门阵列）

Mounting Type :

Surface Mount

Number of Gates :

2188742

Number of I/O :

660

Number of LABs/CLBs :

7776

Number of Logic Elements/Cells :

34992

Operating Temperature :

0°C ~ 85°C (TJ)

Package / Case :

860-BGA Exposed Pad

Product Status :

Obsolete

Supplier Device Package :

860-FBGA (42.5x42.5)

Total RAM Bits :

589824

Voltage - Supply :

1.71V ~ 1.89V