XC7Z007S-1CL225I

制造商 :

AMD Xilinx

产品分类 :

片上系统 (SoC)

Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

225-LFBGA, CSPBGA

Peripherals :

DMA

Primary Attributes :

Artix™-7 FPGA, 23K Logic Cells

Product Status :

Active

RAM Size :

256KB

Speed :

667MHz

Supplier Device Package :

225-CSPBGA (13x13)